The VersaCut High-Precision Laser Cutting System is designed for advanced micro-assembly and material processing tasks, offering cutting, deburring, and ablation with sub-micron accuracy. Using precision laser technology, VersaCut provides burr-free, clean edges while minimising thermal stress and material distortion. Its integrated vision system, programmable automation, and modular design make it suitable for both R&D environments and industrial production. Whether cutting metals, polymers, or composites, VersaCut ensures precision and repeatability. It is widely adopted across medical device manufacturing, semiconductor processing, photonics packaging, and aerospace industries where high-quality micro-cutting and material structuring are essential.

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Laser Precision Cutting

Delivers high-quality, burr-free cuts with minimal heat-affected zones.

Integrated Ablation & Deburring

Combines cutting with micro-deburring and ablation for cleaner processing.

Active Vision Alignment

Machine vision ensures precise targeting and monitoring of cutting paths.

Programmable Automation

Recipe-driven workflows enable repeatability and higher throughput.

Compact & Modular Platform

Adaptable for laboratory prototyping or industrial-scale production.

Advantages:

• Provides sub-micron precision for cutting, ablation, and structuring

• Burr-free, clean cuts reduce post-processing requirements

• Programmable automation enhances yield and repeatability

• Versatile system handles metals, ceramics, polymers, and composites

• Compact footprint suitable for labs and production lines

• Reduces thermal damage to sensitive materials

• Enhances product stability, reliability, and performance

• Trusted across industries for high-quality material processing

Medical Devices

Used for stents, implants, surgical instruments, and microfluidic components requiring burr-free precision cuts.

Semiconductor & Microelectronics

Supports dicing, wafer trimming, and packaging processes with clean, high-resolution laser cuts.

Photonics & Optical Communications

Enables structuring of optical components, fibre arrays, and PIC packaging.

Aerospace & Defence

Applied in cutting lightweight composites, turbine components, and high-performance alloys.

Automotive & EV Industry

Supports micro-cutting for battery components, sensors, and lightweight EV structures.

Consumer Electronics & AR/VR

Used in micro-cutting of camera modules, sensors, and compact electronic assemblies.

Industrial Manufacturing

Applied in toolmaking, precision components, and prototyping requiring clean edges.

Research & Development

Facilitates experimental material processing and custom prototyping at research institutions.

The VersaCut system delivers high-speed, high-accuracy cutting, ablation, and deburring, ensuring superior product quality across industries where precision micro-processing is critical.

United Spectrum Instruments is the authorised distributor of Nanosystec’s VersaCut system in India, providing advanced laser cutting and ablation solutions with complete support.

• Genuine VersaCut systems with full manufacturer warranty

• Expertise across medical devices, semiconductors, aerospace, and photonics

• Pan-India installation, training, and after-sales technical support

• Application-specific consultation for R&D and industrial production

• Competitive pricing with trusted local expertise

With proven expertise in photonics and high-precision micro-assembly, United Spectrum Instruments ensures Indian industries and research organisations gain access to world-class laser cutting platforms that deliver accuracy, efficiency, and long-term reliability.