Ultrafast Laser System for Selective Laser Etching (SLE)
The Ultrafast Laser System for Selective Laser Etching (SLE) is an advanced femtosecond laser solution engineered for true three-dimensional microstructuring inside transparent materials such as...
Ultrafast Laser System for Selective Laser Etching (SLE)
Ultrafast Laser System for Selective Laser Etching (SLE) for High-Precision 3D Glass Microfabrication
The Ultrafast Laser System for Selective Laser Etching (SLE) is an advanced femtosecond laser solution engineered for true three-dimensional microstructuring inside transparent materials such as glass and fused silica. By combining ultrashort pulse laser modification with selective chemical etching, this technology enables the creation of complex internal channels, cavities, and freeform geometries that cannot be achieved with conventional surface machining techniques.
The SLE process is non-thermal and maskless, ensuring excellent dimensional accuracy, high aspect ratios, and superior internal surface quality without inducing cracks or stress in the material. This precise control over internal structures allows designers and engineers to realise intricate 3D features embedded deep within glass substrates, opening new possibilities in functional micro-design.
Ideal for applications in microfluidics, photonics, biomedical devices, advanced optics, and lab-on-chip systems, SLE delivers unmatched precision and design freedom for next-generation glass microfabrication. United Spectrum Instruments, the official distributor of Akoneer systems in India, provides application expertise, system integration support, and reliable after-sales service to help industries and research institutions deploy SLE technology with confidence.
Understanding Ultrafast Laser System for Selective Laser Etching (SLE)
This ultrafast laser platform integrates two complementary processes: laser micro-milling for precise surface structuring and Selective Laser-Induced Etching for true 3D internal fabrication. Femtosecond pulses locally modify glass at the focal volume through nonlinear absorption, enabling selective chemical etching of only the laser-modified regions. The result is the ability to form high-aspect-ratio channels, cavities, and waveguides inside transparent substrates while also performing surface milling and texturing. Advanced multi-axis motion and SLE-optimised software ensure micron-level alignment, depth control, and consistent outcomes across complex geometries.
Technical Specifications
| Parameter | Specification |
|---|---|
| Working Area 1 | 300 × 300 × 200 mm |
| Working Area 2 | 600 × 400 × 200 mm |
| Wavelength (IR) | 1030 nm |
| Wavelength (Green) | 515 nm |
| Wavelength (UV) | 343 nm |
| Wavelength Configuration | One wavelength, combination of two, or all three |
| Laser Power | Up to 80 W @ 1030 nm |
| Accuracy | < 1 µm |
Key Features and Advantages
Ultrafast Femtosecond Pulse Processing
Ultrashort pulses confine energy to the focal region, enabling non-thermal material modification with minimal residual stress or microcracking.
True 3D Internal Structuring with SLE
Create enclosed channels, overhangs, and multi-level structures inside glass—capabilities not achievable with surface-only methods.
Precision Laser Micro-Milling
High-resolution surface milling and texturing deliver smooth finishes, sharp edges, and accurate depth control for micro-optical and fluidic interfaces.
High Aspect Ratio Capability
Supports structures exceeding 20:1 aspect ratios, ideal for microfluidics, MEMS supports, and optical interconnects.
Wide Glass and Transparent Material Compatibility
Processes fused silica, borosilicate glass, quartz, and other transparent substrates without compromising optical quality.
Advanced Motion and Focus Control
Multi-axis stages and high-NA optics enable accurate positioning in X, Y, and Z for complex volumetric designs.
SLE-Optimised CAD/CAM Workflow
Dedicated path planning and parameter control streamline design-to-production for repeatable, scalable manufacturing.
Clean, Maskless Manufacturing
Eliminates masks and extensive cleanroom infrastructure, reducing cost, lead time, and process complexity.
Applications Across Industries
Microfluidics and Lab-on-Chip
Fabrication of leak-tight, enclosed microchannels, mixers, and multi-level networks for diagnostics, analysis, and organ-on-chip systems.
Photonics and Integrated Optics
Creation of buried waveguides, couplers, and hybrid photonic–fluidic structures with precise refractive control.
Biomedical and Analytical Devices
Microchambers, capillary arrays, and transparent pathways for implantable diagnostics, drug delivery, and chemical synthesis.
MEMS and High-Aspect-Ratio Glass Components
Internal supports, cavities, and hermetic features for sensors, encapsulation, and optical MEMS assemblies.
Advanced Optics and Diffractive Elements
Free-form micro-optics, phase plates, beam shapers, and diffractive surfaces integrated within glass substrates.
Semiconductor and Electronics Packaging
Embedded channels and voids for thermal management, optical routing, and compact interconnect solutions.
Aerospace and Defence
Optical alignment structures, sealed microchambers, and ruggedised photonic components for harsh environments.
Why Choose United Spectrum Instruments?
United Spectrum Instruments, the official distributor of Akoneer systems in India, delivers advanced ultrafast laser platforms for micro-milling and SLE applications. We support customers across India with application consultation, sample validation, system integration, and training to ensure smooth deployment. With deep expertise in femtosecond laser processing and glass microfabrication, we enable reliable results and scalable production.
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Official distributor in India for Akoneer ultrafast laser micro-milling and SLE systems
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Strong expertise in femtosecond laser processing and glass microfabrication
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Application consultation, sample validation, integration, and operator training
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Nationwide service and long-term support for reliable, future-ready manufacturing solutions
FAQs
How does SLE differ from conventional laser ablation?
SLE enables internal volume modification followed by selective chemical etching, allowing true 3D structures inside glass.
Can surface micro-milling and SLE be combined on one system?
Yes, the platform supports both processes seamlessly for integrated surface and internal fabrication.
What structure sizes are achievable?
Internal features from 1–10 microns and high aspect ratios are achievable, depending on material and process settings.
Is the process suitable for production environments?
Yes, with high-repetition-rate lasers and automated stages, the system supports scalable manufacturing.
Which materials can be processed?
Transparent substrates such as fused silica, borosilicate glass, quartz, and similar materials are fully supported.
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FAQs
How does SLE differ from conventional laser ablation?
SLE enables internal volume modification followed by selective chemical etching, allowing true 3D structures inside glass.
Can surface micro-milling and SLE be combined on one system?
Yes, the platform supports both processes seamlessly for integrated surface and internal fabrication.
What structure sizes are achievable?
Internal features from 1–10 microns and high aspect ratios are achievable, depending on material and process settings.
Is the process suitable for production environments?
Yes, with high-repetition-rate lasers and automated stages, the system supports scalable manufacturing.
Which materials can be processed?
Transparent substrates such as fused silica, borosilicate glass, quartz, and similar materials are fully supported.
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