Picosecond Laser Micro-Scribing Machine
The picosecond laser micro-scribing machine represents a major advancement in ultrafast laser micro-machining, enabling high-speed, high-precision patterning with minimal thermal impact. Using ultrashort picosecond laser...
Picosecond Laser Micro-Scribing Machine
Redefining Picosecond Laser Micro-Scribing Machine for Ultrafast, High-Precision Thin-Film and Microfabrication Applications
The picosecond laser micro-scribing machine represents a major advancement in ultrafast laser micro-machining, enabling high-speed, high-precision patterning with minimal thermal impact. Using ultrashort picosecond laser pulses, the system delivers micron-level accuracy while preserving the integrity of thin films, layered materials, and delicate substrates—without any mechanical contact.
By eliminating tool wear and significantly reducing heat-affected zones, picosecond laser micro-scribing ensures clean edges, consistent feature definition, and excellent repeatability. This makes it particularly well suited for applications such as thin-film scribing, selective layer removal, and fine patterning where precision and process stability are critical.
Ideal for both high-volume industrial production and advanced R&D environments, picosecond laser micro-scribing supports next-generation manufacturing across electronics, medical devices, aerospace, and solar technologies. United Spectrum Instruments is the official distributor in India for M-Solv, providing application expertise, system integration support, and dependable after-sales service for ultrafast laser micro-machining solutions.
Understanding Picosecond Laser Micro-Scribing Machine
A Picosecond Laser Micro-Scribing Machine utilises ultrashort laser pulses—measured in trillionths of a second—to precisely remove or modify material through controlled ablation. This process limits thermal diffusion, allowing accurate scribing of thin films and multi-layer structures without damaging underlying layers. Integrated CNC motion systems ensure exact positioning and smooth scanning paths, enabling complex patterns and dense geometries. The result is a versatile, non-contact micro-machining platform capable of delivering fine features, high throughput, and exceptional process stability across a wide range of materials and applications.
Technical Specifications
| Specification | Value |
| Laser Type | UV Laser or Fibre Laser |
| Wavelength | 355 nm to 1064 nm |
| Power Output | 5W to 50W |
| Scribing Speed | Up to 1000 mm/s |
| Minimum Feature Size | < 10 micrometres |
| Control System | CNC with intuitive GUI |
| Cooling System | Air- or Water-cooled (depending on config) |
Key Features and Advantages
Ultrashort Picosecond Pulse Processing
Picosecond pulses enable clean, precise scribing with minimal heat transfer, preserving material properties and functional layers.
Sub-10 Micron Feature Resolution
The system supports extremely fine scribe lines, making it ideal for high-density circuits, thin-film devices, and micro-scale components.
Minimal Heat-Affected Zone
Cold ablation prevents melting, delamination, or micro-cracking, ensuring high-quality results on sensitive or layered substrates.
Wide Material Compatibility
Effectively scribes metals, semiconductors, ceramics, glass, polymers, transparent conductive oxides, and composite films.
High-Speed Industrial Performance
Scribing speeds of up to 1000 mm/s support both rapid prototyping and scalable production without compromising precision.
Advanced CNC Motion and Control
Multi-axis motion with intuitive graphical interfaces allows programmable patterns, repeatable results, and complex geometry execution.
Clean, Non-Contact Manufacturing
No mechanical tools, no consumables, and no chemical processing result in lower maintenance, reduced contamination, and sustainable operation.
Automation-Ready Architecture
Designed for integration into automated production lines with support for inline inspection, robotic handling, and process monitoring.
Applications Across Industries
Electronics and Semiconductor Manufacturing
Used for wafer scribing, thin-film patterning, microvia definition, flexible circuit processing, and photonic device fabrication.
Medical Device Manufacturing
Enables precise scribing of microfluidic channels, implantable electrodes, surgical tools, and biocompatible substrates with clean finishes.
Solar Cell and Photovoltaic Production
Supports P1, P2, and P3 scribing, edge isolation, and selective patterning of transparent conductive layers in thin-film solar cells.
Aerospace and Defence
Applied for micro-patterning of composites, traceability marking, sensor calibration features, and precision surface modification.
Automotive Electronics and Sensors
Used for scribing thin-film coatings, sensor elements, MEMS devices, and electronic modules used in advanced vehicle systems.
Micro-Optics and Photonics
Ideal for waveguide definition, optical circuit structuring, micro-lens patterning, and photonic integrated circuit processing.
Luxury Goods and Watchmaking
Supports fine engraving, decorative micro-patterns, serial marking, and aesthetic detailing on metals, ceramics, and sapphire.
Research and Development
Widely used for rapid prototyping, experimental material studies, microchannel fabrication, and academic research applications.
Why Choose United Spectrum Instruments?
United Spectrum Instruments, the official distributor in India, delivers advanced Picosecond Laser Micro-Scribing Machines tailored to the evolving needs of Indian industry and research institutions. We go beyond equipment supply by offering expert application consultation, system customisation, and end-to-end deployment support. With deep expertise in ultrafast laser processes, we ensure faster implementation, reliable performance, and scalable microfabrication solutions.
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Official distributor in India for picosecond laser micro-scribing systems
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Strong expertise in ultrafast laser processing and precision microfabrication
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Application consultation, system customisation, and workflow integration support
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Professional installation, operator training, and long-term after-sales service
FAQs
What is the minimum scribing width achievable?
Less than 10 microns, depending on laser wavelength and material.
Can this system scribe transparent materials like glass?
Yes. With UV lasers, transparent substrates like glass and polymers can be cleanly scribed.
Is this machine suitable for thin-film patterning?
Absolutely. It is ideal for patterning coatings, films, and layered substrates with precision.
What safety features are included?
Class-1 laser enclosure, emergency stop systems, interlocks, and exhaust filtration.
Can it be used in an automated production line?
Yes. The system supports robotic integration, conveyor handling, and inline inspection modules.
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FAQs
What is the minimum scribing width achievable?
Less than 10 microns, depending on laser wavelength and material.
Can this system scribe transparent materials like glass?
Yes. With UV lasers, transparent substrates like glass and polymers can be cleanly scribed.
Is this machine suitable for thin-film patterning?
Absolutely. It is ideal for patterning coatings, films, and layered substrates with precision.
What safety features are included?
Class-1 laser enclosure, emergency stop systems, interlocks, and exhaust filtration.
Can it be used in an automated production line?
Yes. The system supports robotic integration, conveyor handling, and inline inspection modules.
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