A glueing station for opto-electronic packaging combines ultra-precise motion control, machine vision, and automated resin handling to align and permanently bond optical components with sub-micron accuracy. Components are positioned in multiple degrees of freedom while optical power, alignment markers, or vision feedback ensure optimal placement. Once aligned, controlled adhesive volumes are dispensed and cured using UV or thermal processes without disturbing the alignment. This approach eliminates manual variability, ensures stable optical coupling, and supports complex assemblies required in laser diode modules, silicon photonics, and advanced optical packaging.

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Nanometre-Level Alignment Accuracy

High-resolution linear and rotary stages enable precise positioning critical for laser diodes, VCSEL arrays, and photonic circuits.

Active and Passive Alignment Capability

Supports vision-based passive alignment as well as active alignment using optical power feedback for maximum coupling efficiency.

Automated Adhesive Dispensing

Precisely dispenses epoxy or resin from nanolitre to millilitre volumes, ensuring uniform bond lines and repeatable results.

Integrated UV and Thermal Curing

Flexible curing options allow compatibility with a wide range of UV-curable, dual-cure, and heat-curing adhesives.

Advanced Machine Vision System

High-resolution cameras with adjustable optics and lighting enable detection of fine optical features, fiducials, and component edges.

Multi-Axis Motion Control

Full control across translational and rotational axes enables complex 3D alignment for edge-coupling, grating coupling, and free-space optics.

Tray-Based and Batch Processing

Efficient tray handling improves throughput, reduces handling errors, and supports scalable production workflows.

Software-Driven Automation

Intuitive software allows recipe creation, barcode-based process selection, and seamless integration with automation or MES systems.

Repeatability and Process Stability

Automated sequences ensure consistent results across batches, improving yield and long-term reliability of optical assemblies.

Laser Diode and VCSEL Module Assembly

Precision alignment and bonding of laser emitters to optics, fibres, and submounts for stable optical output and thermal performance.

Silicon Photonics and PIC Packaging

Accurate die-to-waveguide alignment, fibre attachment, and bonding of photonic chips with minimal insertion loss.

Optical Communication Systems

Assembly of transceivers, multiplexers, and fibre-coupled modules used in data centres and telecom networks.

LiDAR and 3D Sensing Modules

High-accuracy bonding of VCSEL arrays, detectors, and optical elements for automotive and consumer sensing applications.

Research and Development Laboratories

Rapid prototyping of experimental optical assemblies, free-space optics, and custom photonic setups.

Semiconductor and Advanced Packaging

Chip-to-substrate bonding, hybrid integration, and heterogeneous packaging of optical and electronic components.

Medical and Sensing Devices

Assembly of optical sensors, diagnostic modules, and biomedical photonic systems requiring stable alignment and clean bonding.

United Spectrum Instruments delivers advanced glueing and alignment stations for photonic and opto-electronic packaging with strong local expertise in India. We support customers from application evaluation and system configuration to installation, training, and after-sales service. Our deep understanding of laser diodes, silicon photonics, and optical assembly processes ensures optimal system selection and faster time-to-production. By partnering with United Spectrum Instruments, customers gain access to proven technology, responsive technical support, and scalable solutions tailored to both R&D and industrial manufacturing needs.