Picosecond Laser Micro-Ablation Machine
As manufacturing advances toward ultra-precision, miniaturisation, and non-contact processing, the picosecond laser micro-ablation machine has become a critical technology for next-generation micro-machining. By using ultrashort...
Picosecond Laser Micro-Ablation Machine
Picosecond Laser Micro-Ablation Machine for Ultrafast, High-Precision Micro-Machining Applications
As manufacturing advances toward ultra-precision, miniaturisation, and non-contact processing, the picosecond laser micro-ablation machine has become a critical technology for next-generation micro-machining. By using ultrashort picosecond laser pulses, the system enables highly controlled material removal with extreme accuracy, making it ideal for producing fine micro-features that demand tight tolerances.
Unlike conventional machining methods or long-pulse laser systems, picosecond laser ablation minimises heat diffusion into the surrounding material. This results in clean edges, negligible heat-affected zones, and preservation of substrate integrity—even on sensitive or advanced materials. The process supports precise structuring, drilling, patterning, and surface modification with excellent repeatability.
Designed for demanding industrial and R&D environments, picosecond laser micro-ablation is widely used across electronics, medical devices, aerospace, automotive, and energy applications. United Spectrum Instruments is the official distributor in India for M-Solv, providing application expertise, system integration support, and reliable after-sales service to help manufacturers implement high-precision micro-ablation solutions with confidence.
Understanding Picosecond Laser Micro-Ablation Machine
A Picosecond Laser Micro-Ablation Machine operates by delivering extremely short laser pulses—measured in trillionths of a second—to remove material through cold ablation rather than melting. This process limits heat diffusion, ensuring precise, repeatable micro-structuring without cracks, burrs, or recast layers. Integrated CNC motion, high-accuracy positioning, and intuitive control software allow complex 2D and 3D patterns to be produced with micron-level precision. The result is a versatile, high-speed micro-machining platform suitable for delicate substrates, multilayer structures, and high-value components.
Technical Specifications
| Parameter | Specification |
| Laser Type | Femtosecond or Picosecond Laser (optional Fibre) |
| Wavelength | 1030 nm / 1064 nm / 515 nm (configurable) |
| Pulse Duration | <300 fs to 10 ps |
| Power Output | 10 W – 100 W |
| Min Feature Size | Down to 10 μm |
| Position Accuracy | ±5 μm |
| Ablation Speed | Up to 1000 mm/s |
| Cooling System | Air or Water cooled |
| Control Software | CNC with GUI, parameter presets, diagnostics |
Key Features and Advantages
Ultrashort Picosecond Pulse Technology
Picosecond pulses enable highly localised material removal, delivering clean ablation with minimal thermal influence on adjacent areas.
Micron-Scale Precision
The system supports feature sizes down to approximately 10 microns, ideal for intricate patterning and fine surface structuring.
Minimal Heat-Affected Zone
Cold ablation prevents melting, warping, or micro-cracks, making the process safe for sensitive layers, coatings, and thin films.
Multi-Material Processing Capability
Efficiently ablates metals, ceramics, glass, polymers, dielectrics, thin films, and composite materials with consistent quality.
High-Speed Industrial Throughput
Ablation speeds of up to 1000 mm/s enable both rapid prototyping and high-volume industrial production.
Advanced CNC Control and Diagnostics
User-friendly CNC software with graphical interfaces allows precise control of pulse energy, repetition rate, focus depth, and scan paths.
Excellent Edge Quality and Surface Finish
Produces smooth edges and low surface roughness, reducing or eliminating the need for secondary finishing processes.
Eco-Friendly and Clean Process
No chemicals, consumables, or mechanical tools are required, resulting in a clean and sustainable manufacturing workflow.
Applications Across Industries
Medical Device Manufacturing
Used for stent structuring, implant surface texturing, microchannels for drug delivery, catheter marker bands, and surgical tool refinement.
Electronics and Semiconductor Fabrication
Ideal for micro-via formation, thin-film patterning, redistribution layer structuring, flexible PCB processing, and photonic device fabrication.
Solar Cell and Energy Technologies
Supports P1, P2, and P3 scribing, selective ablation of transparent conductive layers, and fine patterning for advanced solar architectures.
Aerospace and Defence
Applied in micro-patterning of composites, selective coating removal, sensor aperture creation, and precision surface modification.
Automotive and Electric Vehicles
Used for injector micro-features, MEMS sensors, airbag components, battery coating ablation, and precision trimming of electronic modules.
Luxury Goods and Watchmaking
Enables intricate engraving, decorative micro-textures, sapphire and ceramic structuring, and anti-counterfeit micro-features.
Why Choose United Spectrum Instruments?
United Spectrum Instruments, the official distributor in India, delivers advanced Picosecond Laser Micro-Ablation Machines tailored to the evolving needs of industry and research institutions. We go beyond equipment supply by offering deep application expertise, system customisation, and seamless deployment support. With strong capabilities in ultrafast laser micromachining, we ensure reliable performance, faster adoption, and scalable manufacturing solutions.
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Official distributor in India for advanced picosecond laser micro-ablation systems
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Expertise in ultrafast laser micro-machining and precision material processing
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Support for application consultation, system customisation, and integration
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Professional installation, operator training, and long-term after-sales service
FAQs
Can this system ablate multi-layer thin films?
Yes, it allows precise removal of single or multiple layers with minimal disruption to the substrate.
Is it compatible with transparent or brittle materials?
Absolutely. It handles materials like glass, sapphire, and ceramics with ultrafast precision and minimal micro-cracks.
Can it be used in cleanroom environments?
Yes. Systems are designed for Class 1000 or better, with options for HEPA-filtered enclosures.
What are the advantages of femtosecond laser ablation over nanosecond lasers?
Femtosecond lasers minimise heat transfer, eliminate burrs, and allow for sub-micron resolution.
Is it possible to automate the process?
Yes, integration with robotic handlers, conveyor systems, or PLCs is supported for inline manufacturing.
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FAQs
Can this system ablate multi-layer thin films?
Yes, it allows precise removal of single or multiple layers with minimal disruption to the substrate.
Is it compatible with transparent or brittle materials?
Absolutely. It handles materials like glass, sapphire, and ceramics with ultrafast precision and minimal micro-cracks.
Can it be used in cleanroom environments?
Yes. Systems are designed for Class 1000 or better, with options for HEPA-filtered enclosures.
What are the advantages of femtosecond laser ablation over nanosecond lasers?
Femtosecond lasers minimise heat transfer, eliminate burrs, and allow for sub-micron resolution.
Is it possible to automate the process?
Yes, integration with robotic handlers, conveyor systems, or PLCs is supported for inline manufacturing.
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